MIT electronics researchers develop a new way to fabricate transistors on the backend of finished dies, to keep pushing the limit of chip densities ever higher
via news.mit.edu
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With smaller process nodes becoming increasingly more expensive to achieve, chip manufacturing engineers are turning to other ways to increase the number of transistors that can be packed into a single die. In some ways similar to traditional chip stacking, one research team has created a way to implement an extra layer of microscopic switches […]